{"title":"Method to Minimize Mechanical Stresses in a Sensitive Element of Micromechanical Devices Under Packaging","authors":"E. Volkova, P. Manin, S. Popkov","doi":"10.53403/9785951505163_2021_26_1_260","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":185259,"journal":{"name":"Труды РФЯЦ-ВНИИЭФ","volume":"80 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Труды РФЯЦ-ВНИИЭФ","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.53403/9785951505163_2021_26_1_260","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
