{"title":"Vertically-Stacked SOI Waveguides for 3-D Photonic Circuits","authors":"C. Brooks, J. Doylend, A. Knights, P. Jessop","doi":"10.1109/GROUP4.2006.1708169","DOIUrl":null,"url":null,"abstract":"We present a fabrication process for vertically-stacked SOI waveguides using spin-on-glass bonding to process individual layers. Simulations have shown that complete power transfer between 5 mum thick waveguides requires a 1.4 mm coupling length","PeriodicalId":342599,"journal":{"name":"3rd IEEE International Conference on Group IV Photonics, 2006.","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"3rd IEEE International Conference on Group IV Photonics, 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GROUP4.2006.1708169","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
We present a fabrication process for vertically-stacked SOI waveguides using spin-on-glass bonding to process individual layers. Simulations have shown that complete power transfer between 5 mum thick waveguides requires a 1.4 mm coupling length
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