J. Hoff, A. Mekkaoui, D. Christian, S. Zimmerman, G. Cancelo, R. Yarema
{"title":"PreFPIX2: core architecture and results","authors":"J. Hoff, A. Mekkaoui, D. Christian, S. Zimmerman, G. Cancelo, R. Yarema","doi":"10.1109/NSSMIC.2000.949879","DOIUrl":null,"url":null,"abstract":"FPIX is a pixel architecture designed for colliding-beam experiments at the Tevatron. Its most important application to date is the BTeV experiment. PreFPIX2 is a chip designed to test the FPIX core, i.e. the pixel control and readout architecture. This FPIX core will be mated to a periphery specific to a particular experiment. Earlier plans called for the BTeV FPIX chip to be designed in a rad-hard process. However, deep-submicron CMOS processes have demonstrated appropriate radiation tolerance at a lower cost and with greater reliability. Therefore, PreFPIX2 has been fabricated in a 0.25 micron process utilizing radiation tolerant design techniques. The architecture has undergone substantial development from earlier versions of FPIX. Most notable are the improvements to the column token passing scheme and to the end-of-column logic.","PeriodicalId":445100,"journal":{"name":"2000 IEEE Nuclear Science Symposium. Conference Record (Cat. No.00CH37149)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE Nuclear Science Symposium. Conference Record (Cat. No.00CH37149)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NSSMIC.2000.949879","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
FPIX is a pixel architecture designed for colliding-beam experiments at the Tevatron. Its most important application to date is the BTeV experiment. PreFPIX2 is a chip designed to test the FPIX core, i.e. the pixel control and readout architecture. This FPIX core will be mated to a periphery specific to a particular experiment. Earlier plans called for the BTeV FPIX chip to be designed in a rad-hard process. However, deep-submicron CMOS processes have demonstrated appropriate radiation tolerance at a lower cost and with greater reliability. Therefore, PreFPIX2 has been fabricated in a 0.25 micron process utilizing radiation tolerant design techniques. The architecture has undergone substantial development from earlier versions of FPIX. Most notable are the improvements to the column token passing scheme and to the end-of-column logic.