A. Haemmerli, Joseph C. Doll, J. Provine, R. T. Howe, David Goldhaber-Gordon, Beth L. Pruitt
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引用次数: 10
Abstract
We evaluated the chemical and electrochemical corrosion resistance of ultra-thin films deposited via atomic layer deposition (ALD) for potential wafer-scale passivation of biomedical microdevices. A variety of ALD coatings can be deposited conformally on metal or silicon surfaces at low temperature. We were able to protect aluminum electrodes against corrosion in ionic media with a voltage stress of 1V for 200 hours using a double ALD film stack of 5nm Al2O3 and 5nm HfO2.
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