{"title":"Tension-Assisted Peeling","authors":"Yongan Huang, Z. Yin, X. Wan","doi":"10.1007/978-981-13-3627-0_4","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":440602,"journal":{"name":"Modeling and Application of Flexible Electronics Packaging","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Modeling and Application of Flexible Electronics Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-981-13-3627-0_4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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