{"title":"Design of a 570 MHz current feedback amplifier on bonded wafer technology","authors":"Taewon Jung","doi":"10.1109/SOUTHC.1996.535100","DOIUrl":null,"url":null,"abstract":"The design of a monolithic, DC to 570 MHz, fast settling, low distortion current feedback amplifier is described. The circuit is fabricated in a complementary bipolar, bonded wafer silicon on insulator (SOI) technology.","PeriodicalId":199600,"journal":{"name":"Southcon/96 Conference Record","volume":"89 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Southcon/96 Conference Record","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOUTHC.1996.535100","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The design of a monolithic, DC to 570 MHz, fast settling, low distortion current feedback amplifier is described. The circuit is fabricated in a complementary bipolar, bonded wafer silicon on insulator (SOI) technology.
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