3D surface mounting

Abstract

This paper presents the results from the research and development of the construction and technology of a 3 dimensional surface mounting. The main idea is to use surface mounting processes for assembly of high density modules. In order to do that, surface mounting on two or more levels is carried out. The difference from the stacked-die and other similar processes is that soldering takes place simultaneously on all levels. There is a predefined displacement aiming to check the stability of the process, and thus the degree of alignment is verified. It is shown that even when small technological error is introduced, process is realizable.