Modelling the Temperature Field of Electronic Devices with the Use of Infrared Thermography

Abstract

Thermal modelling of electronic devices is one of the most important tools for assessing their reliability under different working regimes. In this study is presented a thermal model of electronic devices, which is based on data obtained by an infrared camera. The PCB is classified into five zones, depending on their temperature. Then the powers dissipated and absorbed by each zone, their steady state temperatures, the convective heat transfer coefficient, etc. are approximated. The aforementioned data is used as input data for the developed model, which is based on the Finite difference method and some well-known physical dependencies. The developed model is verified by comparing the simulated data with the experimentally obtained one. It could be used to investigate the thermal behavior of the device under different operating conditions.