{"title":"Fabrication and thermal stability characterization of Ru electrode used for high power contact RF MEMS switch","authors":"Hongze Zhang, Zhihong Li","doi":"10.1109/NEMS.2013.6559746","DOIUrl":null,"url":null,"abstract":"This paper presents the fabrication and thermal stability of the Ru electrode used for high power Ru-Au contact RF MEMS switch with microspring contact design. Here we develop a new process with bilayer lift-off and strain release layer to get the 3000 Å Ti/Au/Ru electrode with excellent smooth edge for high power handling and low loss. Furthermore, the thermal test at 400°C , 500°C and 600°C over 1 hour has been done. Investigation of the surface with SEM and EDX shows that the electrode has a good thermal stability at 400°C, which is proper for high power handling.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMS.2013.6559746","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents the fabrication and thermal stability of the Ru electrode used for high power Ru-Au contact RF MEMS switch with microspring contact design. Here we develop a new process with bilayer lift-off and strain release layer to get the 3000 Å Ti/Au/Ru electrode with excellent smooth edge for high power handling and low loss. Furthermore, the thermal test at 400°C , 500°C and 600°C over 1 hour has been done. Investigation of the surface with SEM and EDX shows that the electrode has a good thermal stability at 400°C, which is proper for high power handling.
本文介绍了用于微弹簧触点设计的大功率Ru- au触点射频MEMS开关的Ru电极的制备及其热稳定性。本文提出了一种双层剥离和应变释放层的新工艺，以获得具有优异光滑边缘的3000 Å Ti/Au/Ru电极，具有高功率处理和低损耗。此外，在400°C, 500°C和600°C下进行了1小时的热测试。SEM和EDX分析表明，该电极在400℃时具有良好的热稳定性，适合大功率处理。
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
