{"title":"Electrical characteristics of GS-TSV in slow wave mode","authors":"Fengjuan Wang, G. Wang, N. Yu","doi":"10.1109/EDAPS.2017.8277028","DOIUrl":null,"url":null,"abstract":"The electrical characteristics of signal-ground through-silicon-via (GS-TSV) in slow-wave mode are analyzed according to microwave theory and simulated by ADS software. The results show that with the increasing radius of TSV, the transmission characteristic is getting better and better, however, with increasing height of TSV, the transmission characteristic of TSV becomes worse within the range from 0 to 15GHz.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8277028","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The electrical characteristics of signal-ground through-silicon-via (GS-TSV) in slow-wave mode are analyzed according to microwave theory and simulated by ADS software. The results show that with the increasing radius of TSV, the transmission characteristic is getting better and better, however, with increasing height of TSV, the transmission characteristic of TSV becomes worse within the range from 0 to 15GHz.
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