{"title":"Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging","authors":"Soon-Bok Lee, J. Jang","doi":"10.1299/JCST.7.265","DOIUrl":null,"url":null,"abstract":"There are two major methods, experimental and numerical approaches, for dealing with the strain and stress analysis essential to reliability assessment of electronic packaging. Both approaches are mutually complementary in view point of their assessment capability. In this paper, experimental and numerical simulation results for analyzing some reliability issues of electronic packages were reviewed, and the role of both approaches were discussed.","PeriodicalId":196913,"journal":{"name":"Journal of Computational Science and Technology","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Computational Science and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1299/JCST.7.265","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
There are two major methods, experimental and numerical approaches, for dealing with the strain and stress analysis essential to reliability assessment of electronic packaging. Both approaches are mutually complementary in view point of their assessment capability. In this paper, experimental and numerical simulation results for analyzing some reliability issues of electronic packages were reviewed, and the role of both approaches were discussed.
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