{"title":"Characterization of metal-in-elastomer connector contact material","authors":"C. Haque","doi":"10.1109/HOLM.1989.77930","DOIUrl":null,"url":null,"abstract":"A technology assessment of new materials that may be useful in the future for interconnection devices, such as connectors, is presented. The work comprises two parts: characterization of Au- or Ag-plated Ni spheres in a silicon polymer matrix, and characterization of gold-capped Ni wires embedded in a silicone polymer matrix. In a silicone polymer matrix, embedded gold-plated metal wires or aligned gold-plated nickel spheres have the unique property of being electrically conductive in the Z-direction (thickness) while maintaining high insulation resistance in the X and Y directions. These materials can be used as an interface for anisotropic electric conduction between metallic elements. Contact resistance distributions as a function of probe area and geometry, load-displacement-resistance, stiffness, and mixed gas test are reported. The data relate to the evaluation of new materials and designs for interconnects in the 80 to 100 per inch range.<<ETX>>","PeriodicalId":441734,"journal":{"name":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOLM.1989.77930","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
A technology assessment of new materials that may be useful in the future for interconnection devices, such as connectors, is presented. The work comprises two parts: characterization of Au- or Ag-plated Ni spheres in a silicon polymer matrix, and characterization of gold-capped Ni wires embedded in a silicone polymer matrix. In a silicone polymer matrix, embedded gold-plated metal wires or aligned gold-plated nickel spheres have the unique property of being electrically conductive in the Z-direction (thickness) while maintaining high insulation resistance in the X and Y directions. These materials can be used as an interface for anisotropic electric conduction between metallic elements. Contact resistance distributions as a function of probe area and geometry, load-displacement-resistance, stiffness, and mixed gas test are reported. The data relate to the evaluation of new materials and designs for interconnects in the 80 to 100 per inch range.<>
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