Thermal Fatigue Life of Copper-Filled Laminated Micropore Based on Response Surface Methodology

Abstract

The copper-filled laminated micropore of the HDI board is the structural basis for the electrical interconnection between the conductive layers of the metal, and its quality determines the reliability of the HDI board. Due to the limitation of technology, it is unavoidable that there are microvoids in the micropore to cause stress concentration, which will greatly reduce the thermal fatigue life of the micropore. In order to study the life model of micropore with microvoid, the different characteristic parameters of microvoid in laminated micropore and the design parameters of HDI board were analyzed in this paper. Taking [3+6+3] the most common commercial HDI board as an example, based on the Box-Behnken experimental design principle, a continuous variable surface model with microporous strain as the response was established. The model can consider the influence of multiple variables in the process of HDI design and board acceptance. It can evaluate multiple factors affecting the micropore life and their interaction, and improve the efficiency and reliability of the design.