Performance Assessment of Sub Threshold Leakage Current Reduction and Power Dissipation in MOSFET for Si, SiGe and GaN Using COMSOL MULTIPHYSICS

Archana R Nair, Anand Krisshna P, Akshaya Anand
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Abstract

This paper illustrates the models of sub-threshold leakage current, threshold voltage and power dissipation depending on the oxide thickness and gate-source voltage for n-channel MOSFET using three different materials like silicon, GaN, SiGe alloy are derived, examined and analyzed. The variation of oxide thickness and drain dopant concentrationhas been included in the working models. In this work, the effects of thesub-threshold leakage current models were analyzed with varying threshold voltage parameter using the COMSOL MULTIPHYSICS software.
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基于COMSOL MULTIPHYSICS的Si, SiGe和GaN的MOSFET亚阈值漏电流减小和功耗性能评估
本文推导了n沟道MOSFET的亚阈值泄漏电流、阈值电压和功耗随氧化物厚度和栅极源电压变化的模型,并对三种不同材料(硅、氮化镓、硅锗合金)进行了检验和分析。在工作模型中考虑了氧化层厚度和漏态掺杂剂浓度的变化。在这项工作中,使用COMSOL MULTIPHYSICS软件分析了不同阈值电压参数下亚阈值泄漏电流模型的影响。
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