{"title":"An experimental study of thermal resistance of a power semiconductor package","authors":"G. Yuqin, W. Yajue","doi":"10.1109/ITHERM.1988.28675","DOIUrl":null,"url":null,"abstract":"An experimental method for measuring packaging material characteristic parameters and the package thermal resistance including the contact resistance is discussed. The physical model based on one-dimensional analysis and the quasi-steady conduction process are developed. A continuous laser beam with uniform intensity is used as a heat source. The thermal diffusivity of beryllia ceramics and the package thermal resistance have been measured. The results can be applied to check the package manufacturing quality.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.1988.28675","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
An experimental method for measuring packaging material characteristic parameters and the package thermal resistance including the contact resistance is discussed. The physical model based on one-dimensional analysis and the quasi-steady conduction process are developed. A continuous laser beam with uniform intensity is used as a heat source. The thermal diffusivity of beryllia ceramics and the package thermal resistance have been measured. The results can be applied to check the package manufacturing quality.<>
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