A substrate integrated magic-T based on higher order mode cavity and slotline

Peng Wu, S. Liao, Q. Xue
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引用次数: 3

Abstract

In this paper, a substrate integrated magic-T is presented and fabricated. It is based on the higher order mode cavity and buried slotline. The wideband transition of SIW TE20 mode is employed to realize the out-of-phase divider while the microstrip-to-slotline transition is used to realize the in-phase divider. The slot is etched on the top of the higher order mode cavity. The ground metal defects are buried inside the multilayer substrate, and thus, in practical applications, additional bolster is not required for the defected ground slot. It is convenient for the proposed magic-T to be integrated with other circuits.
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基于高阶模腔和槽线的基板集成magic-T
本文提出并制作了一种集成magic-T的衬底。它基于高阶模腔和埋地槽线。采用SIW TE20模式的宽带跃迁实现外相分频器,采用微带-槽线跃迁实现同相分频器。所述槽蚀刻在所述高阶模腔的顶部。接地金属缺陷被埋在多层基板内部,因此,在实际应用中,对于有缺陷的接地槽不需要额外的支撑。所提出的magic-T便于与其他电路集成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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