Yanfeng Shen, E. Liivik, F. Blaabjerg, D. Vinnikov, Huai Wang, A. Chub
{"title":"Reliability evaluation of an impedance-source PV microconverter","authors":"Yanfeng Shen, E. Liivik, F. Blaabjerg, D. Vinnikov, Huai Wang, A. Chub","doi":"10.1109/APEC.2018.8341154","DOIUrl":null,"url":null,"abstract":"The reliability of an impedance-source PV microconverter is evaluated based on the real-field mission profile. As part of a PV microinverter, the dc-dc microconverter is firstly described. Then the electro-thermal and lifetime models are built for the most reliability-critical components, i.e., the power semiconductor devices and capacitors. The finite element method (FEM) simulation is used for the thermal impedance extraction. The mission profile, i.e., the ambient temperature and solar irradiance, from Aalborg, Denmark is applied to the built electrothermal model. Finally, the thermal loading profiles and annual wear-out damage accumulation are obtained. In addition, experimental measurements from a 300-W converter prototype are given.","PeriodicalId":113756,"journal":{"name":"2018 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.2018.8341154","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
The reliability of an impedance-source PV microconverter is evaluated based on the real-field mission profile. As part of a PV microinverter, the dc-dc microconverter is firstly described. Then the electro-thermal and lifetime models are built for the most reliability-critical components, i.e., the power semiconductor devices and capacitors. The finite element method (FEM) simulation is used for the thermal impedance extraction. The mission profile, i.e., the ambient temperature and solar irradiance, from Aalborg, Denmark is applied to the built electrothermal model. Finally, the thermal loading profiles and annual wear-out damage accumulation are obtained. In addition, experimental measurements from a 300-W converter prototype are given.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
