{"title":"SmartFoil: a Novel Assembly Technology for Electronic Circuit Boards in Multifunctional Units","authors":"O. Kvashenkina, P. Gabdullin, A. V. Arkhipov","doi":"10.1109/EEXPOLYTECH.2018.8564437","DOIUrl":null,"url":null,"abstract":"The paper presents a new original technology for fast assembly of electronic boards, named SmartFoil. Basic operation principles are described. SmartFoil is compared with the most widely used present techniques of assembly of microwave units, such as furnace soldering, wave soldering, manual or automated tinning.","PeriodicalId":296618,"journal":{"name":"2018 IEEE International Conference on Electrical Engineering and Photonics (EExPolytech)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Conference on Electrical Engineering and Photonics (EExPolytech)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EEXPOLYTECH.2018.8564437","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
The paper presents a new original technology for fast assembly of electronic boards, named SmartFoil. Basic operation principles are described. SmartFoil is compared with the most widely used present techniques of assembly of microwave units, such as furnace soldering, wave soldering, manual or automated tinning.
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