{"title":"Design and Analysis of Compact and Broadband High Gain Micro strip Patch Antennas","authors":"Shivani Gupta, Saket Kumar","doi":"10.1109/CNT.2014.7062715","DOIUrl":null,"url":null,"abstract":"In this paper Design and Analysis of Compact and Broadband High Gain Micro strip Patch Antennas is presented using via hole technique for enhancement in bandwidth. This paper present optimization of inductance using Via hole technique, via hole technique used to reduced losses of ground plane and enhance surface current, the proposed antenna is validated in IE3D Simulator, from the simulation results we found this technique provided broad bandwidth. The proposed antenna used for C-Band application, Microstrip Patch Antenna (MPA) is generally used in modern communication devices and a large part of day-to-day communication is done through it. Study of literature of past few year shows that, the leading work on MPA is focused on designing compact sized broadband microstrip antenna. But inherently MPA have narrow bandwidth so to enhance bandwidth various techniques are engaged.","PeriodicalId":347883,"journal":{"name":"2014 International Conference on Communication and Network Technologies","volume":"108 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International Conference on Communication and Network Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CNT.2014.7062715","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
In this paper Design and Analysis of Compact and Broadband High Gain Micro strip Patch Antennas is presented using via hole technique for enhancement in bandwidth. This paper present optimization of inductance using Via hole technique, via hole technique used to reduced losses of ground plane and enhance surface current, the proposed antenna is validated in IE3D Simulator, from the simulation results we found this technique provided broad bandwidth. The proposed antenna used for C-Band application, Microstrip Patch Antenna (MPA) is generally used in modern communication devices and a large part of day-to-day communication is done through it. Study of literature of past few year shows that, the leading work on MPA is focused on designing compact sized broadband microstrip antenna. But inherently MPA have narrow bandwidth so to enhance bandwidth various techniques are engaged.