A new scheme of low-cost TO-based butterfly-type laser module packaging

Abstract

A novel scheme of butterfly-type laser module packaging employing low-cost transistor outline (TO) structure is proposed. By applying a low-cost TO packaging technique, the cost and fabrication time of the butterfly-type laser module packaging was reduced and the fabrication yield was increased. The coupling efficiency of fabricated TO-based butterfly-type laser module packaging was over 70%. The results indicate that the proposed TO-based butterfly-type laser module packaging can be used in low-cost lightwave transmission systems.