Advanced Non-Soldering Interconnection

Abstract

The number of soldered joints per circuit is rapidly increasing, especially on surface mounted boards. As a result, defective solder joints are becoming the dominant cause of board failures. Also, there is a move to closer spacing of connections which leads to solder bridging and difficulty of flux removal and joint inspection. These, coupled with other solder disadvantages, have led the military and industrial companies to look for alternative component connection methods. Because of the high cost of components and the circuit substrates it is mandatory to be able to replace defective parts easily.