Song Jinrong, T. Li, Ren Jun, Di Hairong, Yang Jianli
{"title":"Fault Isolation of Die-to-Die Communication Error Failure","authors":"Song Jinrong, T. Li, Ren Jun, Di Hairong, Yang Jianli","doi":"10.1109/IPFA.2018.8452505","DOIUrl":null,"url":null,"abstract":"This paper presented two real cases on the fault isolation of die-to-die communication error failure. A new method was introduced to maintain backside accessibility while the interbonding signals can be measured from front side. Based on the interbonding signal failing symptom, customized functional Optical Beam Induced Resistance Change(OBIRCH) or Photon Emission Microscopy(PEM) analysis proved to be very efficient for the fault isolation.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452505","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presented two real cases on the fault isolation of die-to-die communication error failure. A new method was introduced to maintain backside accessibility while the interbonding signals can be measured from front side. Based on the interbonding signal failing symptom, customized functional Optical Beam Induced Resistance Change(OBIRCH) or Photon Emission Microscopy(PEM) analysis proved to be very efficient for the fault isolation.
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