Reliability Prediction using Large MOS Capacitors

E. Domangue, R. Rivera, Clark G. Shepard
{"title":"Reliability Prediction using Large MOS Capacitors","authors":"E. Domangue, R. Rivera, Clark G. Shepard","doi":"10.1109/IRPS.1984.362033","DOIUrl":null,"url":null,"abstract":"Large MOS capacitors were used in a study of the dielectric breakdown mechanism to establish the relationship among the results of various test methods. Reliance on models was avoided through the use of a test vehicle which duplicated the structures of a 64K dynamic memory device. A method is proposed to predict device reliability using process monitors at the time of wafer manufacture.","PeriodicalId":326004,"journal":{"name":"22nd International Reliability Physics Symposium","volume":"259 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1984-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"22nd International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1984.362033","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

Large MOS capacitors were used in a study of the dielectric breakdown mechanism to establish the relationship among the results of various test methods. Reliance on models was avoided through the use of a test vehicle which duplicated the structures of a 64K dynamic memory device. A method is proposed to predict device reliability using process monitors at the time of wafer manufacture.
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基于大型MOS电容器的可靠性预测
采用大型MOS电容器对介质击穿机理进行了研究,建立了各种测试方法结果之间的关系。通过使用复制64K动态存储器结构的测试车辆,避免了对模型的依赖。提出了一种利用晶圆制造时的过程监控来预测器件可靠性的方法。
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