Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding

Abstract

In this work, three thermal-aware kernel mappings are proposed for a three-dimensional multi-mode channel decoding architecture. The proposed kernel mappings can reduce the peak temperature and support different thermal and latency constraints. In our experiments, we show the peak temperature can be reduced from 16.2°C~33.8°C. Besides, we also demonstrate that different mapping is chosen under different thermal and latency constraints.