{"title":"Case Study on Wire Bonding - Related Partial Discharge on High-Voltage Isolators","authors":"Manita Duangsang, Nophakam Thankham","doi":"10.1109/IPFA.2018.8452558","DOIUrl":null,"url":null,"abstract":"Most devices which failed during High Voltage Isolation Testing seen a lateral dielectric breakdown after decapsulation. Failure analysis results explained the irregularity in IC assembly process causing the partial discharge that leads to dielectric breakdown, called treeing. This explanation together with root cause verification and wire bond parameter simulation from assembly process pointed out that the improper parameter modification resulted to electrical treeing.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452558","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Most devices which failed during High Voltage Isolation Testing seen a lateral dielectric breakdown after decapsulation. Failure analysis results explained the irregularity in IC assembly process causing the partial discharge that leads to dielectric breakdown, called treeing. This explanation together with root cause verification and wire bond parameter simulation from assembly process pointed out that the improper parameter modification resulted to electrical treeing.
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