Vertical via design techniques for multi-layered P/G networks

Shuai Li, Jin Shi, Yici Cai, Xianlong Hong
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引用次数: 4

Abstract

In multi-layered power/ground (P/G) networks, to connect the whole network together, vertical vias are usually placed at intersections between metal wires of adjoining layers. In this paper, a deep study about the design of vertical vias is presented. First we present an efficient heuristic algorithm based on sensitivity analysis to optimize via allocation in early design stage. Compared with even allocation, averagely our algorithm is capable of reducing worst voltage drop by 8.43% while using the same or even less number of vias. Also, adjoint network method is utilized and significantly improves the efficiency of our algorithm. Next, we demonstrate that by linking metal wires of nonadjacent layers, cross-layer vias are powerful in eliminating "hot" areas which suffer from large voltage drop on bottom layer. A similar heuristic algorithm is also developed for the addition of cross-layer vias.
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多层P/G网络的垂直通径设计技术
在多层电源/地(P/G)网络中,为了将整个网络连接在一起,通常在相邻层金属导线之间的交叉处放置垂直过孔。本文对垂直通孔的设计进行了深入的研究。首先提出了一种基于灵敏度分析的启发式算法,在设计早期通过分配进行优化。与均匀分配相比,在使用相同或更少的过孔数量的情况下,我们的算法平均能够将最差电压降降低8.43%。同时利用伴随网络方法,大大提高了算法的效率。接下来,我们证明了通过连接非相邻层的金属线,跨层通孔在消除底层受大电压降影响的“热”区域方面是强大的。对于跨层通孔的添加,也开发了类似的启发式算法。
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