Panel: Best ways to use billions of devices on a chip

G. Martin
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Abstract

We all know that Moore's law is good for at least a few more generations of silicon process, and this will give rise to many integrated circuits having billions of transistors on them. The leading 45 nm processors being announced are getting close to a billion transistors as of 2007. But how can we best use these devices in the future? Integrating more and more features and functions onto SoCs may not be the optimal use for all of these billions of resources. Indeed, to even have a working device at 45, 32, 22 and 16 nm may require new architectures and new structures to be incorporated. Among the many ideas that can be advanced to best use the 'billions and billions served' are: (1) multicore and multiprocessor systems (2) yet more memory, to hold the embedded software and data required by multiprocessor architectures (3) more and more elaborate on-chip interconnect and network structures (4) redundant structures for defect tolerance (5) structures and architectures for dynamic error recovery (6) a variety of schemes to allow lower and lower power and energy consumption At the same time, billions of transistors on a chip will pose increasing challenges to our design methodologies, integration approaches and design tools. How can we best conceive of, architect, design, integrate, verify and manufacture such devices? This panel draws on several academic and industry experts who will discuss their views on the best things to integrate into future ICs, and the best ways to do that integration. It will give an excellent opportunity to the audience to challenge and discuss these ideas and to advocate their own views. As well as considering the 'best' ways to use these resources, the panel will also be a good opportunity to discuss the 'worst' ways to proceed. What architectural dead-ends should be avoided as we move through each silicon process generation?
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面板:在一个芯片上使用数十亿设备的最佳方法
我们都知道,摩尔定律至少对未来几代硅制程是有益的,这将导致许多集成电路产生数十亿个晶体管。截至2007年,领先的45纳米处理器已接近10亿个晶体管。但在未来,我们如何才能最好地利用这些设备呢?将越来越多的特性和功能集成到soc上可能不是所有这些数十亿资源的最佳用途。事实上,即使是在45,32,22和16nm的工作器件,也可能需要新的架构和新的结构。为了更好地利用“数十亿美元的服务”,可以提出许多想法,其中包括:(1)多核和多处理器系统(2)更多的内存,以容纳多处理器架构所需的嵌入式软件和数据(3)越来越复杂的片上互连和网络结构(4)冗余结构的缺陷容忍(5)结构和架构的动态错误恢复(6)各种方案,以允许越来越低的功耗和能耗同时,芯片上数十亿个晶体管将对我们的设计方法、集成方法和设计工具提出越来越大的挑战。我们如何才能最好地构思、构建、设计、集成、验证和制造这样的设备?该小组邀请了几位学术和行业专家,他们将讨论他们对集成到未来ic中的最佳内容以及实现集成的最佳方法的看法。它将给观众一个绝佳的机会来挑战和讨论这些想法,并倡导自己的观点。除了考虑使用这些资源的“最佳”方式外,该小组也将是讨论“最坏”方式的好机会。在我们进行每个硅制程生成时,应该避免哪些架构上的死胡同?
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