S. Tomabechi, K. Wada, S. Saigusa, H. Matsuhashi, H. Nakase, K. Masu, K. Tsubouchi
{"title":"Development of high quality AlN epitaxial film for 2.4 GHz front-end SAW matched filter","authors":"S. Tomabechi, K. Wada, S. Saigusa, H. Matsuhashi, H. Nakase, K. Masu, K. Tsubouchi","doi":"10.1109/ULTSYM.1999.849399","DOIUrl":null,"url":null,"abstract":"We have developed aluminum nitride (AlN) epitaxial growth technology using Knudsen pressure MOCVD method. The thickness uniformity was ±1%. However groove-like cracks were formed on the surface of the AlN epitaxial film. AlN deposition on off-angle substrates and the AlN deposition at high temperature have been investigated for eliminating the cracks on the surface. AlN deposition on an Al2O3 surface which is -4 degree off-angle from c'-axis has resulted in elimination of the cracks from the SEM (Scanning Electron Microscope) observations. The cracks in an AlN film deposited at a higher temperature of 1140°C/40mTorr are found to be completely eliminated on the whole 2\"-φ wafer from SEM and laser-scan microscope observations. The propagation loss has been evaluated from the characteristics of time domain impulse response of 2.4 GHz matched filters fabricated on 2\"-φ wafers. The propagation loss of crackless AlN films is drastically improved by one order compared with that of cracked AlN films.","PeriodicalId":339424,"journal":{"name":"1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ULTSYM.1999.849399","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
We have developed aluminum nitride (AlN) epitaxial growth technology using Knudsen pressure MOCVD method. The thickness uniformity was ±1%. However groove-like cracks were formed on the surface of the AlN epitaxial film. AlN deposition on off-angle substrates and the AlN deposition at high temperature have been investigated for eliminating the cracks on the surface. AlN deposition on an Al2O3 surface which is -4 degree off-angle from c'-axis has resulted in elimination of the cracks from the SEM (Scanning Electron Microscope) observations. The cracks in an AlN film deposited at a higher temperature of 1140°C/40mTorr are found to be completely eliminated on the whole 2"-φ wafer from SEM and laser-scan microscope observations. The propagation loss has been evaluated from the characteristics of time domain impulse response of 2.4 GHz matched filters fabricated on 2"-φ wafers. The propagation loss of crackless AlN films is drastically improved by one order compared with that of cracked AlN films.