Polyimide Interlevel Insulation Process/Design Limitations

Abstract

This paper describes a polyimide interlevel metal insulation process. The use of polyimide near high voltage devices can result in anomalous leakage in certain regions at elevated temperatures. The paper summarizes the reliability investigation on discrete devices fabricated with polyimide, as the interlevel material, as well as characterization data which support design criteria permitting the use of polyimide as an interlevel insulation material.