{"title":"Terahertz camera-less imaging of deep trench and whole SiC wafer defects","authors":"H. Das, B. Greenwood, A. Rahman","doi":"10.1364/aio.2021.th1a.4","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":271968,"journal":{"name":"Applied Industrial Optics 2021","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Industrial Optics 2021","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/aio.2021.th1a.4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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