C. Scognamillo, A. P. Catalano, V. d’Alessandro, L. Codecasa, A. Castellazzi
{"title":"Defect Detection in Double-Sided Cooled Power Modules by Structure Functions","authors":"C. Scognamillo, A. P. Catalano, V. d’Alessandro, L. Codecasa, A. Castellazzi","doi":"10.1109/prime55000.2022.9816814","DOIUrl":null,"url":null,"abstract":"This paper presents an approach based on structure functions aimed to the defect detection in state-of-the-art double-sided cooled power modules. The investigation is conducted by means of highly detailed 3-D finite-element method thermal simulations on the exact replica of a power module. Typical defects are emulated ad-hoc in the numerical environment: solder delamination, detached interconnections, and voids/bubbles in the thermal interface material. It is demonstrated that assigned defects give specific shapes to the structure functions; once these shapes are classified, the nature of the defects can be easily unraveled from experimental data.","PeriodicalId":142196,"journal":{"name":"2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/prime55000.2022.9816814","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents an approach based on structure functions aimed to the defect detection in state-of-the-art double-sided cooled power modules. The investigation is conducted by means of highly detailed 3-D finite-element method thermal simulations on the exact replica of a power module. Typical defects are emulated ad-hoc in the numerical environment: solder delamination, detached interconnections, and voids/bubbles in the thermal interface material. It is demonstrated that assigned defects give specific shapes to the structure functions; once these shapes are classified, the nature of the defects can be easily unraveled from experimental data.