An Evaluation of Interface Strength at a Vertex in a Three-Dimensional Joint Considering Residual Thermal Stresses Using the Three-Dimensional Boundary Element Method

H. Koguchi, N. Meo
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引用次数: 2

Abstract

Dissimilar material properties may cause stress singularities, which may lead to the failure of the bonding part in joints. It is important to analyze stress singularity fields in order to evaluate the strength of the interface in three-dimensional joints. Thermal residual stresses occur during cooling after bonding of the joints, and stress singularities can also be caused by these thermal stresses. In the present study, a boundary element method and an eigenvalue analysis based on the finite element method are used to evaluate the intensity of the stress singularity. A three-dimensional boundary element program based on the fundamental solution for two-phase isotropic materials is used. The strength of the interface of two types of Si-resin specimens with different bonding areas is investigated analytically and experimentally. Stress singularity analysis is first carried out for a delamination force acting on the specimen. The stress singularity field for the residual stresses is determined while varying the material property in resin with temperature. Combining the stress singularity field for the delamination force and the residual thermal stress yields a final stress distribution for evaluating the strength of the interface. Finally, the strength of the interface in three-dimensional joints was determined as 0.0914-0.133 MPa·m0.68.
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考虑残余热应力的三维结合部顶点界面强度的三维边界元法
不同的材料性能会产生应力奇点,从而导致接头连接部分的破坏。在三维节理中,分析应力场是评价界面强度的重要手段。热残余应力在接头粘合后的冷却过程中产生,应力奇点也可能由这些热应力引起。本文采用边界元法和基于有限元法的特征值分析方法来计算应力奇点的强度。采用了基于两相各向同性材料基本解的三维边界元程序。对两种硅树脂试样在不同粘接面积下的界面强度进行了分析和实验研究。首先对作用在试样上的分层力进行了应力奇异性分析。测定了树脂中材料性能随温度变化时残余应力的应力奇异场。结合分层力的应力奇异场和残余热应力,得到了评价界面强度的最终应力分布。最后确定三维节理界面强度为0.0914 ~ 0.133 MPa·m0.68。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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