An efficient cooling system for telecommunication equipment rooms

Abstract

The evaluation of air-flow systems for telecommunication equipment rooms was carried out experimentally. Parameters were room air temperature distribution and ambient temperature of electric parts, i.e. air temperature around circuit boards, which are influenced by an air-flow system. The under-floor air supply and overhead return system has shown to be superior to other flow systems and its allowable average heat density was up to 1.1 kW/m/sup 2/. A microcomputer control unit was developed for the cooling unit. It is shown that this control can optimize the refrigeration cycle of the cooling unit under low outdoor air temperature, minimizing running costs.<>