Monolithic Integration of Photo-Diode and Transimpedance Amplifier in CMOS 90 nm Technology

Tzu-Hsuan Hsu, Jau‐Ji Jou, Tien-Tsorng Shih, Y. Hung
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Abstract

Herein, we designed and simulated the monolithic integration of photo-diode (PD) and transimpedance amplifier (TIA) in CMOS 90 nm technology. In the standard process, a PN-junction structure with an illuminated area of 39.48 $\mu$m × 39.48 $\mu$m was designed as the PD. The breakdown voltage of the PD is -10.5V. At a reverse bias voltage of 3V, the PD has a dark current of 2.6 pA and a capacitance of 1.03 pF. The TIA is composed of a regulated gate cascode circuit, a differential amplifier paralleling with an edge peak generator. The PD and the TIA are monolithically integrated, the overall transimpedance gain is 40.3 dB$\Omega$, and the bandwidth is 4.1 GHz. The integrated design of PD and TIA could be applied in 5 Gb/s optical receivers.
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90纳米CMOS技术中光电二极管和跨阻放大器的单片集成
在此,我们设计并模拟了光电二极管(PD)和跨阻放大器(TIA)在CMOS 90nm工艺下的单片集成。在标准工艺中,设计了一个照射面积为39.48 $\mu$ m × 39.48 $\mu$ m的pn结结构作为PD。PD击穿电压为-10.5V。在反向偏置电压为3V时,PD的暗电流为2.6 pA,电容为1.03 pF。TIA由一个稳压门级联电路、一个差分放大器和一个边峰发生器并联组成。PD和TIA采用单片集成,整体跨阻增益为40.3 dB $\Omega$,带宽为4.1 GHz。PD和TIA集成设计可以应用于5gb /s光接收机。
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