Study of “hot spots” arising from non-homogeneity in the micro-structures of dissipative materials

B. Yap, C. Newberg
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引用次数: 1

Abstract

DC resistance testing using standard commercial electrodes has been a simple, standard way adopted by many for their evaluation of dissipative materials. However, we have observed that this test is ineffective for the detection of ldquohot spotsrdquo arising from non-homogeneities in the micro-structures of some dissipative materials. We have employed a combination of tests using a direct sharp tip probe for both resistance and charge decay measurements and a small non-contact electrostatic voltmeter for localized surface voltage measurements. These combined tests furnish better information about ldquohot spotrdquo characteristics and their formation in dissipative materials. We wish to share the test techniques, the results and the analysis of our present study.
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耗散材料微观结构非均匀性引起的“热点”研究
使用标准商用电极进行直流电阻测试已成为许多人评估耗散材料时采用的一种简单、标准的方法。然而,我们已经观察到,这种测试对于某些耗散材料的微观结构中由非均匀性引起的ldquohot spots的检测是无效的。我们使用直接尖头探头进行电阻和电荷衰减测量,并使用小型非接触式静电电压表进行局部表面电压测量。这些综合测试提供了关于ldquohot spoquo特性及其在耗散材料中的形成的更好信息。我们希望分享我们目前研究的测试技术、结果和分析。
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Improved wafer-level VFTLP system and investigation of device turn-on effects Wire bonding tip study for extremely ESD sensitive devices Characterizing automated handling equipment using discharge current measurements Study of “hot spots” arising from non-homogeneity in the micro-structures of dissipative materials VF-TLP systems using TDT and TDRT for kelvin wafer measurements and package level testing
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