{"title":"Millimeter wave monolithic transceivers","authors":"C. Seashore","doi":"10.1109/irmm.1987.9127009","DOIUrl":null,"url":null,"abstract":"A significant program Is currently underway 1n the United States to Investigate, develop, and produce a variety of GaAs analog circuits for use 1n microwave and millimeter wave sensors and systems. This represents a “new wave” of RF technology which promises to significantly change system engineering thinking relative to RF Architectures. At millimeter wave frequencies, we look forward to a relatively high level of critical component integration based on MESFET and HEMT device Implementations. These designs will spawn more compact RF front ends with colocated antenna/transceiver functions and innovative packaging concepts which will survive and function 1n a typical military operational environment which includes challenging temperature, shock, and special handling requirements.","PeriodicalId":399243,"journal":{"name":"1987 Twelth International Conference on Infrared and Millimeter Waves","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1987-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1987 Twelth International Conference on Infrared and Millimeter Waves","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/irmm.1987.9127009","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A significant program Is currently underway 1n the United States to Investigate, develop, and produce a variety of GaAs analog circuits for use 1n microwave and millimeter wave sensors and systems. This represents a “new wave” of RF technology which promises to significantly change system engineering thinking relative to RF Architectures. At millimeter wave frequencies, we look forward to a relatively high level of critical component integration based on MESFET and HEMT device Implementations. These designs will spawn more compact RF front ends with colocated antenna/transceiver functions and innovative packaging concepts which will survive and function 1n a typical military operational environment which includes challenging temperature, shock, and special handling requirements.