{"title":"Packaging requirements for high volume wireless communications","authors":"D. R. Green, J.P. Beccone, R.B. Crispell","doi":"10.1109/MWSYM.1992.188297","DOIUrl":null,"url":null,"abstract":"Summary form only given. The authors presented an overview of present and anticipated high-volume wireless communication applications, with emphasis on cellular and cordless phones, for MMICs (monolithic microwave integrated circuits) and MICs. The packaging requirements are discussed for existing and emerging standards.<<ETX>>","PeriodicalId":165665,"journal":{"name":"1992 IEEE Microwave Symposium Digest MTT-S","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 IEEE Microwave Symposium Digest MTT-S","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.1992.188297","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Summary form only given. The authors presented an overview of present and anticipated high-volume wireless communication applications, with emphasis on cellular and cordless phones, for MMICs (monolithic microwave integrated circuits) and MICs. The packaging requirements are discussed for existing and emerging standards.<>
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