{"title":"3D-MID for Space","authors":"Dr. Etienne Hirt, Klaus Ruzicka","doi":"10.1109/ESTC.2018.8546449","DOIUrl":null,"url":null,"abstract":"Space applications demand highly reliable and low weight systems. Three-dimensional moulded interconnect device (3D-MID) processes have the potential to fulfil the requirements by combining the (electronic) packaging with routing and mechanical structure. In this paper 3D-MID technology is reviewed, most promising techniques identified and test vehicles are investigated with the focus on space usage within the ESA Artes 5.1 program.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546449","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Space applications demand highly reliable and low weight systems. Three-dimensional moulded interconnect device (3D-MID) processes have the potential to fulfil the requirements by combining the (electronic) packaging with routing and mechanical structure. In this paper 3D-MID technology is reviewed, most promising techniques identified and test vehicles are investigated with the focus on space usage within the ESA Artes 5.1 program.
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