Microengineered Sensors: A Review

D. Misra, W. Carr
{"title":"Microengineered Sensors: A Review","authors":"D. Misra, W. Carr","doi":"10.1109/ELECTR.1991.718181","DOIUrl":null,"url":null,"abstract":"Recently the application of bulk and surface processing of silicon related materials has made it possible to successfully fabricate micromechanical structures in the range of 0.5 to 500 microns, which exhibits unrestrained motion over at least one degree of freedom. The sculptural fabrication techniques can be used to realize a variety of measurement devices (microengineered sensors). This paper describes the recent developments in the area of design, fabrication and operation of these microengineered sensors. The possible integration of the sensing elements with the signal processing circuit on one chip (the so called smart sensors) is also being discussed briefly.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electro International, 1991","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELECTR.1991.718181","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Recently the application of bulk and surface processing of silicon related materials has made it possible to successfully fabricate micromechanical structures in the range of 0.5 to 500 microns, which exhibits unrestrained motion over at least one degree of freedom. The sculptural fabrication techniques can be used to realize a variety of measurement devices (microengineered sensors). This paper describes the recent developments in the area of design, fabrication and operation of these microengineered sensors. The possible integration of the sensing elements with the signal processing circuit on one chip (the so called smart sensors) is also being discussed briefly.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
微工程传感器:综述
近年来,硅相关材料的体加工和表面加工的应用使得成功制造0.5至500微米范围内的微机械结构成为可能,这些结构在至少一个自由度上表现出不受约束的运动。雕塑制造技术可用于实现各种测量装置(微工程传感器)。本文介绍了这些微工程传感器在设计、制造和操作方面的最新进展。将传感元件与信号处理电路集成在一块芯片上(即所谓的智能传感器)的可能性也进行了简要讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Connector Reliability Testing: Noise Spectral Analysis Statistical Control Of Electronic Measurements State-of-the-Art Of Artificial Neural Networks And Applications To Mars Robots Differences Between Commercial and Military Testing Monorail Maglev Technology
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1