Laser Assisted Device Alteration, Efficient Application for Soft Failure Localization on Advanced Node

Abstract

Laser assisted device alteration (LADA) is a laser-based technique to verify device under test and has been widely used for soft failure debugging. This technique requires the device to be scanned with a laser while it is under active stimulation by the tester. By monitoring test results and scanning laser position, it gives the location of defect and critical path. In the case of complex logic failures in advanced technology nodes, defect localization continues to be a challenge in the failure analysis field. Dynamic electrical failure analysis (D-EFA) techniques and their derivatives can increase efficiency for defect localization techniques. In this paper, several soft failure case studies will be demonstrated by using LADA techniques and further nano-probing results will also be described by physical failure analysis (PFA).