Chip-Film Patch Sensor System with Integrated Read-out ASIC for Biomedical Applications

Abstract

Hybrid Systems-in-Foil (HySiF) encompass large-area thin-film components and ultra-thin, high performance CMOS chips, which are integrated into a flexible polymeric foil substrate. In this work, we present a customized Chip-Film Patch (CFP) system where an ultra-thin read-out ASIC is embedded in spin-coated polyimide film to monitor the breathing system of newborns and premature infants. The latest developments in the CFP process using the low stress polyimide PI2611 are shown. Particularly, the process optimization for the spin-coating and etching of polyimide are highlighted. Besides, the electrical characterization of the ultra-thin read-out chip is presented. Finally, the feasibility of a polyimide-based strain sensor and its electro-mechanical characterization are demonstrated.