Pub Date : 2020-08-16DOI: 10.1109/FLEPS49123.2020.9239541
R. Mansour, O. Omoniyi, A. Reid, L. Liang, R. O’Leary, J. Windmill
The desire for highly sensitive, miniature sensors and actuators has grown in recent years. This desire has led to the recent development of 3D-printed sensors and actuators using piezocomposites. The use of 3D-printing leads to the rapid development of devices at lower costs and device personalization. This work describes the process of developing a novel 0-3 piezocomposite material, 3D – printing using a digital light processing technique, and characterization. The composite material was made using a photopolymer, grey resin and lead magnesium niobate and lead titanate (PMN-PT) with particles sizes $5 mu mathrm{m}$. 3D-printing of a membrane using the piezoelectric composite with high concentrations of PMN-PT was achieved with good print resolution and remarkably high $d _{33}$ coefficient of 74 pm/V, measured using the laser vibrometer technique. Thin film samples of the composites were also made using spin coating technique to produce composites with 0-3 connectivity pattern and layer thickness of $90 mu mathrm{m}$. The bottom-up digital light processing method used provides a narrow design space in which the composite may be selectively cured and the parameters which allow successful generation of highly piezoelectric printed parts was investigated. The microstructure of the piezocomposites was analyzed using a scanning electron micrograph.
近年来，对高灵敏度、微型传感器和执行器的需求不断增长。这种愿望导致了最近使用压电复合材料的3d打印传感器和执行器的发展。3d打印的使用导致设备以更低的成本和设备个性化的快速发展。这项工作描述了开发一种新型0-3压电复合材料的过程，使用数字光处理技术进行3D打印，并进行表征。该复合材料由光聚合物、灰色树脂、铌酸镁铅和钛酸铅(PMN-PT)组成，粒径为$5 mu mathm {m}$。利用激光测振仪技术测量了具有高浓度PMN-PT的压电复合材料的3d打印膜，具有良好的打印分辨率和非常高的$d _{33}$系数(74 pm/V)。采用自旋镀膜技术制备复合材料的薄膜样品，制备出0-3连接模式、层厚为$90 mu mathm {m}$的复合材料。自下而上的数字光处理方法提供了一个狭窄的设计空间，在这个空间中，复合材料可以被选择性地固化，并研究了允许成功生成高压电打印部件的参数。利用扫描电镜对复合材料的微观结构进行了分析。
{"title":"A Novel 3D-Printed (0-3) Piezocomposite Material for Sensing Applications","authors":"R. Mansour, O. Omoniyi, A. Reid, L. Liang, R. O’Leary, J. Windmill","doi":"10.1109/FLEPS49123.2020.9239541","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239541","url":null,"abstract":"The desire for highly sensitive, miniature sensors and actuators has grown in recent years. This desire has led to the recent development of 3D-printed sensors and actuators using piezocomposites. The use of 3D-printing leads to the rapid development of devices at lower costs and device personalization. This work describes the process of developing a novel 0-3 piezocomposite material, 3D – printing using a digital light processing technique, and characterization. The composite material was made using a photopolymer, grey resin and lead magnesium niobate and lead titanate (PMN-PT) with particles sizes $5 mu mathrm{m}$. 3D-printing of a membrane using the piezoelectric composite with high concentrations of PMN-PT was achieved with good print resolution and remarkably high $d _{33}$ coefficient of 74 pm/V, measured using the laser vibrometer technique. Thin film samples of the composites were also made using spin coating technique to produce composites with 0-3 connectivity pattern and layer thickness of $90 mu mathrm{m}$. The bottom-up digital light processing method used provides a narrow design space in which the composite may be selectively cured and the parameters which allow successful generation of highly piezoelectric printed parts was investigated. The microstructure of the piezocomposites was analyzed using a scanning electron micrograph.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"129 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115681535","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-08-16DOI: 10.1109/FLEPS49123.2020.9239588
Andrew Closson, Haley Richards, Lin Dong, Zhe Xu, John X. J. Zhang
We present a method for printing conductive polymers onto P(VDF-TrFE) nanofibers to create all-polymer piezoelectric devices. Inkjet printing is an attractive fabrication approach for rapid prototyping of flexible electronics, but until now with limited applications in developing P(VDF-TrFE) nanofiber-based devices. We have demonstrated an approach to infill the void space within a piezoelectric nanofibrous matrix to allow for the inkjet printing of aqueous inks while avoiding leakage that typically leads to electrical shorting and without significant loss of voltage output. This was done using a diluted PDMS solution and a commercially available conductive ink. The 1 cm2 devices showed peak-peak voltages greater than 0.5 V and a 259 mV/N sensitivity. Using these techniques, flexible piezoelectric sensing can be done in an array format, paving the way for unique forms of wearable physical biomarker sensing.
{"title":"Method for Inkjet-printing PEDOT:PSS polymer electrodes on piezoelectric PVDF-TrFE fibers","authors":"Andrew Closson, Haley Richards, Lin Dong, Zhe Xu, John X. J. Zhang","doi":"10.1109/FLEPS49123.2020.9239588","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239588","url":null,"abstract":"We present a method for printing conductive polymers onto P(VDF-TrFE) nanofibers to create all-polymer piezoelectric devices. Inkjet printing is an attractive fabrication approach for rapid prototyping of flexible electronics, but until now with limited applications in developing P(VDF-TrFE) nanofiber-based devices. We have demonstrated an approach to infill the void space within a piezoelectric nanofibrous matrix to allow for the inkjet printing of aqueous inks while avoiding leakage that typically leads to electrical shorting and without significant loss of voltage output. This was done using a diluted PDMS solution and a commercially available conductive ink. The 1 cm2 devices showed peak-peak voltages greater than 0.5 V and a 259 mV/N sensitivity. Using these techniques, flexible piezoelectric sensing can be done in an array format, paving the way for unique forms of wearable physical biomarker sensing.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"280 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125860631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-08-16DOI: 10.1109/FLEPS49123.2020.9239580
D. Kosmas, Martijn Schouten, G. Krijnen
We propose a modified Power Law Model [1] for hysteresis compensation. A simplification of the original model, resulting in a lower number of parameters to be estimated, is introduced. It has no nonlinear resistor in the output stage and the nonlinear resistance function in the input section(s) is given by a sinh function resulting in $3 N +2$ parameters for a model with N input stages. A cantilever beam with two symmetric piezoresistive sensors was 3D printed and shown to exhibit hysteretic behavior. The sensor’s differential measurements have been used to obtain training and validation data. We present promising fitting results obtained with a single cell model and 5 parameters only. Finally, the inverse model (compensator) is derived and applied to the experimental data in order to strongly reduce the hysteretic nonlinearity.
{"title":"Hysteresis Compensation of 3D Printed Sensors by a Power Law Model with Reduced Parameters","authors":"D. Kosmas, Martijn Schouten, G. Krijnen","doi":"10.1109/FLEPS49123.2020.9239580","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239580","url":null,"abstract":"We propose a modified Power Law Model [1] for hysteresis compensation. A simplification of the original model, resulting in a lower number of parameters to be estimated, is introduced. It has no nonlinear resistor in the output stage and the nonlinear resistance function in the input section(s) is given by a sinh function resulting in $3 N +2$ parameters for a model with N input stages. A cantilever beam with two symmetric piezoresistive sensors was 3D printed and shown to exhibit hysteretic behavior. The sensor’s differential measurements have been used to obtain training and validation data. We present promising fitting results obtained with a single cell model and 5 parameters only. Finally, the inverse model (compensator) is derived and applied to the experimental data in order to strongly reduce the hysteretic nonlinearity.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122714423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-08-16DOI: 10.1109/FLEPS49123.2020.9239571
Caroline Yu, Kevin A. Kam, Marco R. Cavallari, I. Kymissis
During surgical procedures where navigation stylets are used to place surgical tools, the stylets are tracked as a rigid entity. However, when body tissue applies force to the stylet tip, the stylet bends and the tip location is lost. Tracking the stylet’s bending and tip displacement can enhance the precision of surgical procedures such as catheter placement for external ventricular drainage. In this work, a flexible strain sensor is integrated at the base of a 1.3 mm diameter surgical navigation stylet. The device tracks the stylet’s bending and tip displacement in two orthogonal directions. Thin-film silver strain gauges are patterned on polydimethylsiloxane (PDMS). The device is then wrapped around and adhered to a stylet using a silicone gel and acrylic adhesive stack. Using a cantilever beam model to fit the stylet deflection, the device’s measurable tip displacement range is between 1 and 11 mm with a limit of detection of 750$mu$m.
{"title":"Tip Tracking of Surgical Navigation Stylets Using Integrated Strain Sensors","authors":"Caroline Yu, Kevin A. Kam, Marco R. Cavallari, I. Kymissis","doi":"10.1109/FLEPS49123.2020.9239571","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239571","url":null,"abstract":"During surgical procedures where navigation stylets are used to place surgical tools, the stylets are tracked as a rigid entity. However, when body tissue applies force to the stylet tip, the stylet bends and the tip location is lost. Tracking the stylet’s bending and tip displacement can enhance the precision of surgical procedures such as catheter placement for external ventricular drainage. In this work, a flexible strain sensor is integrated at the base of a 1.3 mm diameter surgical navigation stylet. The device tracks the stylet’s bending and tip displacement in two orthogonal directions. Thin-film silver strain gauges are patterned on polydimethylsiloxane (PDMS). The device is then wrapped around and adhered to a stylet using a silicone gel and acrylic adhesive stack. Using a cantilever beam model to fit the stylet deflection, the device’s measurable tip displacement range is between 1 and 11 mm with a limit of detection of 750$mu$m.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129225394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-08-16DOI: 10.1109/fleps49123.2020.9239473
{"title":"FLEPS 2020 Index","authors":"","doi":"10.1109/fleps49123.2020.9239473","DOIUrl":"https://doi.org/10.1109/fleps49123.2020.9239473","url":null,"abstract":"","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121701417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-08-16DOI: 10.1109/FLEPS49123.2020.9239530
N. Qaiser, A. Damdam, S. Khan, M. Hussain
Recently, interconnect based stretchable electronic devices have attained growing interest due to its application for various state-of-the-art technologies. Here, we report an engineered design of spiral interconnects for a series of stretchable networks referred to as the symmetrical series; wherein spirals connect to the island in the symmetry manner. A systematic analysis of Si-based spiral interconnects by numerical modeling, and experiments show that our design provides higher stretchability of 165% in comparison to the conventionally used nonsymmetrical design. The reason for high mechanical reliability is attributed to the favorable unwrapping profile of spiral interconnect due to the nature of forces acting on it during the stretching process. In contrast, for the nonsymmetrical series, the nature of tensile forces produces the rotation, and resultant tilting of spiral arm results in low stretchability of 150%. As a result, nonsymmetrical interconnect fails at earlier stages of stretching. Our study demonstrates the significance of the orientation of spiral interconnects linked to the island to attain the high performance of stretchable electronic devices.
{"title":"Symmetrical orientation of spiral-interconnects for high mechanical stability of stretchable electronics","authors":"N. Qaiser, A. Damdam, S. Khan, M. Hussain","doi":"10.1109/FLEPS49123.2020.9239530","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239530","url":null,"abstract":"Recently, interconnect based stretchable electronic devices have attained growing interest due to its application for various state-of-the-art technologies. Here, we report an engineered design of spiral interconnects for a series of stretchable networks referred to as the symmetrical series; wherein spirals connect to the island in the symmetry manner. A systematic analysis of Si-based spiral interconnects by numerical modeling, and experiments show that our design provides higher stretchability of 165% in comparison to the conventionally used nonsymmetrical design. The reason for high mechanical reliability is attributed to the favorable unwrapping profile of spiral interconnect due to the nature of forces acting on it during the stretching process. In contrast, for the nonsymmetrical series, the nature of tensile forces produces the rotation, and resultant tilting of spiral arm results in low stretchability of 150%. As a result, nonsymmetrical interconnect fails at earlier stages of stretching. Our study demonstrates the significance of the orientation of spiral interconnects linked to the island to attain the high performance of stretchable electronic devices.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115548057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-08-16DOI: 10.1109/FLEPS49123.2020.9239524
S. Nappi, C. Su, H. Luan, J. Rogers, G. Marrocco
Like rigid objects, also soft and elastic manufactured materials for industrial and biomedical applications are subjected to fatigue stress that might speed up the aging process and even cause premature failures. The occurrence of early signs of damaging, like the arising of surface cracks, could avoid more severe critical events, especially when biomedical soft prosthesis are involved (such as artificial breast, stomach, bladder).A thin-film stretchable wireless sensor for surface monitoring is here proposed. The device is based on a densely distributed electrode exploiting, at the macro-scale, a Space-Filling Curve pattern, and a meandered profile in the micro-scale. Interconnection with a wrapped Radiofrequency Identification antenna permits to transmit the status of the electrode to remote, with no battery onboard. The device was manufactured by means of electron beam deposition over a thin elastomer. Surface defects of size larger than 0.9mm to 9mm can be detected with probability of 60% to 90%, respectively. Thanks to its double-scale meanderings, the sensor is highly tolerant to stretch keeping its shape nearly unchanged up to a 35% strain.
{"title":"Stretchable Wireless Sensor Skin for the Surface Monitoring of Soft Objects","authors":"S. Nappi, C. Su, H. Luan, J. Rogers, G. Marrocco","doi":"10.1109/FLEPS49123.2020.9239524","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239524","url":null,"abstract":"Like rigid objects, also soft and elastic manufactured materials for industrial and biomedical applications are subjected to fatigue stress that might speed up the aging process and even cause premature failures. The occurrence of early signs of damaging, like the arising of surface cracks, could avoid more severe critical events, especially when biomedical soft prosthesis are involved (such as artificial breast, stomach, bladder).A thin-film stretchable wireless sensor for surface monitoring is here proposed. The device is based on a densely distributed electrode exploiting, at the macro-scale, a Space-Filling Curve pattern, and a meandered profile in the micro-scale. Interconnection with a wrapped Radiofrequency Identification antenna permits to transmit the status of the electrode to remote, with no battery onboard. The device was manufactured by means of electron beam deposition over a thin elastomer. Surface defects of size larger than 0.9mm to 9mm can be detected with probability of 60% to 90%, respectively. Thanks to its double-scale meanderings, the sensor is highly tolerant to stretch keeping its shape nearly unchanged up to a 35% strain.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114335504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-08-16DOI: 10.1109/FLEPS49123.2020.9239432
Chengyang Luo, R. Fernández-García, I. Gil
With the trend of textile sensors, embroidered sensors for body fluids measurements are getting attention. In this paper, an embroidered textile sensor with a capacitive spiral structure is proposed and used to measure the capacitance when being poured by sucrose solutions with different levels of concentration at different frequencies. Since the coefficient of determination $(mathrm{R}^{2})$ near 0.997 from 250 Hz to 500 Hz shows the curves fitting well, the feasibility of the capacitance varying with different levels of concentration (0 - 250 mg/dl) in a linear curve at certain frequency range (250 - 500 Hz) is confirmed.
{"title":"Embroidered Textile Capacitive Sensor for Sucrose Solutions Measurement","authors":"Chengyang Luo, R. Fernández-García, I. Gil","doi":"10.1109/FLEPS49123.2020.9239432","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239432","url":null,"abstract":"With the trend of textile sensors, embroidered sensors for body fluids measurements are getting attention. In this paper, an embroidered textile sensor with a capacitive spiral structure is proposed and used to measure the capacitance when being poured by sucrose solutions with different levels of concentration at different frequencies. Since the coefficient of determination $(mathrm{R}^{2})$ near 0.997 from 250 Hz to 500 Hz shows the curves fitting well, the feasibility of the capacitance varying with different levels of concentration (0 - 250 mg/dl) in a linear curve at certain frequency range (250 - 500 Hz) is confirmed.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117303575","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-08-16DOI: 10.1109/FLEPS49123.2020.9239558
Riikka Mikkonen, M. Mäntysalo
In this paper, we report our recent work with an inkjettable polydimethylsiloxane (PDMS) solution, which is intended for multilayer printing of soft electronics. Here, we present optimized printing parameters for the PDMS ink, and the surface treatment modification methods of PDMS for conductive track printing are discussed in further detail. In this paper, processing parameters are described for successful multilayer printing of soft electronics, such as sensors.
{"title":"Inkjettable, polydimethylsiloxane based soft electronics","authors":"Riikka Mikkonen, M. Mäntysalo","doi":"10.1109/FLEPS49123.2020.9239558","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239558","url":null,"abstract":"In this paper, we report our recent work with an inkjettable polydimethylsiloxane (PDMS) solution, which is intended for multilayer printing of soft electronics. Here, we present optimized printing parameters for the PDMS ink, and the surface treatment modification methods of PDMS for conductive track printing are discussed in further detail. In this paper, processing parameters are described for successful multilayer printing of soft electronics, such as sensors.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116166200","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-08-16DOI: 10.1109/fleps49123.2020.9239481
{"title":"[FLEPS 2020 Front matter]","authors":"","doi":"10.1109/fleps49123.2020.9239481","DOIUrl":"https://doi.org/10.1109/fleps49123.2020.9239481","url":null,"abstract":"","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"149 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125777418","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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