Impact of emerging semiconductor technology on transportation vehicles in the year 2000

S. Bansal
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Abstract

We were requested to predict the future specifications of the electronic materials, electronic packages and micro processors for high performance computer systems going as far out as the year 2000 and beyond. These were to be based on the emerging requirements of the end users. Literature and conferences yielded very little quantitative data. As a result, we understood to design and develop a deterministic and macroscopic model based on physics, math, VLSI design, architecture and integration level considerations. The resulting model transcended the electronic world from system performance to microprocessor description to packaging specifications and required material's specifications. Based on this model, it is likely, that the world will see an integration of 100 million transistors on a single chip providing clock frequencies approaching 213 MHz and CPU power near about 238 MIPS. Transportation is a major business for Alcoa. We have used our model to examine what architectural directions the Mobile 2000 would take for satisfying its command and control, navigational, entertainment, communication, engine, transmission and body/cockpit control and management systems. A scenario is developed based on the current and emerging requirements for the above functions leading to the automobile of the year 2000. This is then translated to yield control and system requirements which then are converted to the total computational requirements. The requirements are used to define the future system specifications based on our model's predictions. Alternative architectures are then presented. Cautions and caveats are discussed based on our experience on several large scale Computer Integrated Manufacturing (CIM) networks', design development and implementation. It is imperative to bring the large scale systems thinking to Mobile 2000's automation and support systems so that the classical pitfalls of cost, performance, lack of planning, ad hoc and proliferation of incompatible systems does not take place in this exciting arena.
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2000年新兴半导体技术对交通工具的影响
我们被要求预测到2000年及以后高性能计算机系统的电子材料、电子封装和微处理器的未来规格。这些将以最终用户的新需求为基础。文献和会议提供的定量数据很少。因此,我们理解设计和开发基于物理,数学,VLSI设计,架构和集成级别考虑的确定性和宏观模型。由此产生的模型超越了电子世界,从系统性能到微处理器描述,再到封装规格和所需材料的规格。基于这个模型,世界上很可能会看到1亿个晶体管集成在一个芯片上,时钟频率接近213兆赫,CPU功率接近238兆赫。运输是美国铝业公司的主要业务。我们使用我们的模型来研究移动2000将采取什么样的架构方向来满足其指挥和控制、导航、娱乐、通信、发动机、传动和车身/驾驶舱控制和管理系统。根据上述功能的当前和新出现的需求,制定了一个方案,以实现2000年的汽车。然后将其转换为产量控制和系统需求,然后将其转换为总计算需求。需求用于根据我们的模型预测来定义未来的系统规范。然后提出了可选择的体系结构。根据我们在几个大型计算机集成制造(CIM)网络的设计、开发和实施方面的经验,讨论了注意事项。必须将大规模系统思维引入Mobile 2000的自动化和支持系统,以便在这个令人兴奋的领域中不会出现成本、性能、缺乏规划、不兼容系统的临时和扩散等传统陷阱。
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