Design and implementation of a parallel image processor chip for a SIMD array processor

M. Sunwoo, S. Ong, B. Ahn, Kyungwoo Lee
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引用次数: 11

Abstract

This paper presents the design and implementation of a sliding memory plane (SliM) image processor chip to build a mesh-connected SIMD architecture called a SliM array processor. The SliM image processor chip consists of 5/spl times/5 processing elements (PEs) connected by a mesh topology. A set of SliM image processor chips can form the SliM array processor. Due to the idea of sliding, that is, overlapping inter-PE communication with computation, the SliM image processor can greatly reduce the inter-PE communication overhead, a significant disadvantage of existing SIMD array processors. In addition, using the by-passing path provides eight-way connectivity even with four physical links. This paper addresses architectures of the SliM image processor chip, the design of an instruction set, and implementation issues. The chip has 55255 gates and twenty-five 128/spl times/9-bit SRAM modules, and was simulated at 18 MHz for the worst case conditions, and will actually run at a higher clock rate. The package type is the 144 pin MQFP. We conduct the performance evaluation of the chip that shows a significant improvement.
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用于SIMD阵列处理器的并行图像处理器芯片的设计与实现
本文提出了一种滑动存储平面(SliM)图像处理器芯片的设计和实现,以构建一个网格连接的SIMD体系结构,称为SliM阵列处理器。SliM图像处理器芯片由5/spl次/5个处理单元(pe)组成,通过网状拓扑结构连接。一组SliM图像处理器芯片可以组成SliM阵列处理器。由于滑动的思想,即将pe间通信与计算重叠,SliM图像处理器可以大大降低pe间通信开销,这是现有SIMD阵列处理器的一个显着缺点。此外,即使有4条物理链路,使用旁路路径也可以提供8路连接。本文讨论了SliM图像处理器芯片的体系结构、指令集的设计和实现问题。该芯片具有55255个门和25个128/spl倍/9位SRAM模块,并且在最坏情况下以18 MHz进行模拟,实际上将以更高的时钟速率运行。包类型是144针MQFP。我们对芯片进行了性能评估,显示出明显的改进。
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