Integrated power electronics modules for 400 V/10 A motor-drive applications using flip-chip flex-circuit technology

Abstract

This paper presents the development of an integrated power packaging platform featuring power dies and driver components integration using flex-circuit interconnection and flip-chip soldering technology. The packaging platform that was previously demonstrated suitably for 42 V/16 A automotive applications is extended to 400 V/10 A motor-drive application, with the electrical performance measured at double-pulse and 10% duty-ratio conditions. The switching characteristics of three different IGBT modules implemented with flip-chip dies or discrete commercial packages on flex-circuitry are evaluated.