A study of drain current in presence of hot carrier effect for sub-micron MOS devices

B. Kumar, A. Singh, C. Prabhu
{"title":"A study of drain current in presence of hot carrier effect for sub-micron MOS devices","authors":"B. Kumar, A. Singh, C. Prabhu","doi":"10.1109/ICEESE.2014.7154571","DOIUrl":null,"url":null,"abstract":"In this paper, we studied the drain current in sub-micron MOS device in presence of hot carrier. The current relation is derived after solving the Poisson equation for surface potential. The effect of hot electrons on the drain current is analyzed in detail. The effect of hot carriers on the current can be minimized by choosing moderate substrate doping. The drain current decreases with increase in voltage which is developed at the boundary of the damaged region and non-damaged region (VP). The drain current is almost zero for larger damaged region irrespective of the sign of hot carrier charge density.","PeriodicalId":240050,"journal":{"name":"2014 2nd International Conference on Electrical, Electronics and System Engineering (ICEESE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 2nd International Conference on Electrical, Electronics and System Engineering (ICEESE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEESE.2014.7154571","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

In this paper, we studied the drain current in sub-micron MOS device in presence of hot carrier. The current relation is derived after solving the Poisson equation for surface potential. The effect of hot electrons on the drain current is analyzed in detail. The effect of hot carriers on the current can be minimized by choosing moderate substrate doping. The drain current decreases with increase in voltage which is developed at the boundary of the damaged region and non-damaged region (VP). The drain current is almost zero for larger damaged region irrespective of the sign of hot carrier charge density.
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亚微米MOS器件热载子效应下漏极电流的研究
本文研究了热载流子存在时亚微米MOS器件的漏极电流。在求解表面势泊松方程后,导出了电流关系。详细分析了热电子对漏极电流的影响。通过选择适度的衬底掺杂,可以将热载流子对电流的影响降到最低。漏极电流随电压的增加而减小,电压产生于损伤区和非损伤区边界(VP)。对于较大的损坏区域,漏极电流几乎为零,与热载子电荷密度的符号无关。
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