Silicon MOSFET technology for RF ICs

D. Lovelace, D. Ngo, J. Costa, N. Camilleri
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引用次数: 6

Abstract

Application of silicon MOSFET technologies to high frequency RF transceiver functions will be presented. Starting with a description of the high frequency characteristics of silicon MOSFETs designed specifically for RF applications. These applications include several RF functions where silicon MOSFETs have not traditionally been used such as low noise amplifiers, balanced mixers, RF switches and integrated power amplifiers. Finally a description of the performance trade-offs associated with silicon BJT (Bipolar Junction Transistor) technology are given along with an evaluation of how BiCMOS (Bipolar-CMOS) technologies can sometimes serve as the best solution to RF IC designs. Another silicon MOSFET device well suited to RF applications is the Thin Film Silicon on Insulator (TFSOI) device [2] shown in Figure 2. This transistor is constructed in the same manner as the device in Figure 1 except that a layer of insulating dielectric is now present between the epi and the substrate. The buried oxide insulator dramatically reduces the source-substrate and drain-substrate capacitance that is inherent to classic MOSFET device architecture and i prohibits the use of a low impedance source ground contacts. 1 I \
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射频集成电路的硅MOSFET技术
将介绍硅MOSFET技术在高频射频收发功能中的应用。首先介绍专为射频应用而设计的硅mosfet的高频特性。这些应用包括几种传统上不使用硅mosfet的RF功能,如低噪声放大器,平衡混频器,RF开关和集成功率放大器。最后描述了与硅BJT(双极结晶体管)技术相关的性能权衡,并评估了BiCMOS(双极cmos)技术有时如何作为射频集成电路设计的最佳解决方案。另一种非常适合射频应用的硅MOSFET器件是如图2所示的绝缘体上硅薄膜(TFSOI)器件[2]。该晶体管的构造方式与图1中的器件相同,只是在外接层和衬底之间现在存在一层绝缘电介质。埋地氧化物绝缘体大大降低了经典MOSFET器件结构固有的源基板和漏基板电容,并且禁止使用低阻抗源地触点。1 I \
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