{"title":"Impedance transparency design for PCI-Express Gen 3 SerDes channel on HDI PCBs","authors":"Jue Chen, Bidyut Sen","doi":"10.1109/ISEMC.2014.6899047","DOIUrl":null,"url":null,"abstract":"AC-coupling capacitor and transition via are the two areas discussed in this paper for the impedance transparency design of a PCI Express Gen 3 backplane channel. The simulation results show that the optimized ground gap for the AC-coupling capacitors and the optimized transition vias helps improve the channel impedance transparency.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2014.6899047","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
AC-coupling capacitor and transition via are the two areas discussed in this paper for the impedance transparency design of a PCI Express Gen 3 backplane channel. The simulation results show that the optimized ground gap for the AC-coupling capacitors and the optimized transition vias helps improve the channel impedance transparency.
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