A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link

Abstract

In order to meet the demand for increasingly higher data rate wireless links, broad-bandwidth transceivers that support high-spectral-efficiency modulation schemes are required. In this paper, a mm-wave transceiver IC operating at 113GHz is demonstrated, achieving a single-channel data rate of 80Gb/s. The transceiver achieves a high level of integration, including LO generation circuitry, a bits-to-RF TX DAC, and two transceiver channels for polarization diversity. The chip is flip-chip packaged onto a PCB with two orthogonally polarized antennas.