{"title":"A new packaging technique for power multichip modules","authors":"C. Gillot, D. Henry, C. Schaeffer, C. Massit","doi":"10.1109/IAS.1999.805978","DOIUrl":null,"url":null,"abstract":"A new packaging technique for power multichip modules has been developed. The components are sandwiched between two DBC (direct bond copper) substrates with aluminum nitride. This innovative technique allows to replace wire bond with flip chip and to cool the module on both sides. Thus, electrical, thermal and reliability performance can be improved.","PeriodicalId":125787,"journal":{"name":"Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IAS.1999.805978","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
A new packaging technique for power multichip modules has been developed. The components are sandwiched between two DBC (direct bond copper) substrates with aluminum nitride. This innovative technique allows to replace wire bond with flip chip and to cool the module on both sides. Thus, electrical, thermal and reliability performance can be improved.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
